ABLESTIK FS163

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK FS163

Main features

  • Equal-Weight BIPAX Mixing
  • Room-Temperature or Heat Cure
  • Broad-Material Industrial Bonding

Product Description

LOCTITE ABLESTIK FS 163 BIPAX is a two-component, non-conductive polyamide/epoxy adhesive for industrial bonding and sealing. Resin and hardener mix at 100:100 by weight, with a typical mixed viscosity of 30,000 mPa s and a 75-minute pot life at 25 deg C. The adhesive cures for 24 hours at 25 deg C or 4 hours at 65 deg C. Its stated operating-temperature range is -60 to 100 deg C. The cured material has a typical Shore D hardness of 77, Izod impact strength of 1.14 ft-lb/in of notch, and dielectric strength of 18 kV/mm.

Key features

  • Equal-weight BIPAX mixing: A 100:100 resin-to-hardener ratio by weight simplifies component proportioning before application.
  • Room-temperature or heat cure: Cures in 24 hours at 25 deg C or 4 hours at 65 deg C for process flexibility.
  • Broad material bonding: Bonds and seals supported metals, rigid plastics, glass, ceramics, rubber, wood, concrete, and other listed materials.

Applications

Applications include industrial bonding and sealing of metals, rigid plastics, glass, ceramics, leather, rubber, wood, and concrete.

Product Family

ABLESTIK FS163

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Amber
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (Resin / Hardener)
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
100:100
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
75 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.12
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
1.0
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
18 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.00×10¹⁴ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Values apply to the mixed two-component adhesive unless another state is shown.

PropertyValueUnitMethod / condition
AppearanceAmberMixed adhesive
Mix ratio, resin:hardener100:100by weightSpecified component ratio
Mixed viscosity30,000mPa s25 deg C
Thixotropic index1.0Mixed material
Specific gravity1.12Mixed material
Pot life75minutes25 deg C
Cure schedule24 at 25 or 4 at 65hours at deg CGuideline room-temperature or heat cure
Optimal storage<=27deg CUnopened container
Technical properties

After-processing / final-state properties

Values are typical for the cured non-conductive adhesive under the stated conditions.

PropertyValueUnitMethod / condition
Operating temperature-60 to 100deg CProduct operating range
Shore D hardness77Typical cured material
Coefficient of linear thermal expansion64ppm/deg CTypical cured material
Izod impact strength1.14ft-lb/in of notchTypical cured material
Dielectric strength18kV/mmTypical cured material
Dielectric constant3.351 kHz; 25 deg C
Dissipation factor0.011 kHz; 25 deg C
Volume resistivity1.00 x 10^14ohm cm25 deg C

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