LOCTITE ABLESTIK CDF 530P

Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other

LOCTITE ABLESTIK CDF 530P

Main features

  • Electrically conductive
  • Thermally conductive
  • QFN, TQFP, eTQFP

Product Description

LOCTITE ABLESTIK CDF 530P,  highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metal leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm .

LOCTITE ABLESTIK CDF 530P offers high MSL reliability, controlled fillet size and does not exhibit resin bleed out. It has good wetting and low warpage on large dies and is recommended for thin wafer handling applications. It comes in 15 (CDF 515P) and 30um and is typically used for QFN, TQFP and eTQFP package applications.

Cure Schedule

  • 30 minute ramp from 25°C to 200°C, hold 60 minutes @ 200°C
  • 30 minute ramp from 25°C to 175°C, hold 60 minutes @ 175°C
Product Family

ABLESTIK CDF530P

1. Select Package Type
2. Select Pieces per roll

Loading pricing…

Product availability
US Shipping in 20 days
CA Shipping in 12 weeks
EU Shipping in 35 days
Packaging
Please select Package Type and Pieces per roll.
TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
5 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.8 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0004 Ohms⋅cm
General Properties
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
30 µm
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
2160 hours

Additional Information



 
 

CDF 500P - Die attach film property comparison

Leading Brands Trust in Our Products and Services

Products that Perform| Knowledge that Serves| Service that Delivers