ABLESTIK 976-1

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK 976-1

Main features

  • Electrically Conductive Thermal Interface
  • 2.1 W/(m K) Thermal Interface
  • 1:1 Meter-Mix Processing

Product Description

LOCTITE® ABLESTIK 976-1 is a silver-filled, electrically conductive epoxy adhesive designed for circuitry formation and component attachment on non-rigid substrates. The flexible adhesive can be applied by automatic dispensing, screen printing, or hand probe and is available either premixed and frozen or as a two-component system with a 1:1 mix ratio. Typical cured properties include thermal conductivity of 2.1 W/(m·K), volume resistivity of 0.0002 ohm-cm, and aluminum-to-aluminum lap shear strength of 5.17 N/mm² at 25°C. Guideline heat-cure options include 2 hours at 125°C, 4 hours at 100°C, or 1 hour at 150°C.

Key features

  • Electrically conductive: Typical cured volume resistivity is 0.0002 ohm-cm.
  • Flexible adhesive system: Designed for use on non-rigid substrates in circuitry formation and component attachment.
  • Multiple application and supply formats: Suitable for automatic dispensing, screen printing, or hand-probe application and supplied premixed frozen or as a 1:1 two-component kit.

Applications / Suitable for

  • Circuitry formation on non-rigid substrates
  • Electronic component attachment
  • Automatic dispensing
  • Screen-printing and hand-probe application
Product Family

ABLESTIK 976-1

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Chemistry Type
Epoxy
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
8 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
66 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.1 W/m.K
Weight Loss @ 300°C
0.2 %
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0002 Ohms⋅cm
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
9000 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties, storage conditions, and guideline cure schedules for the adhesive before final processing.

Property Value Unit Method / condition
Technology Epoxy — Electrically conductive adhesive
Appearance Silver paste — As supplied
Supply format Premixed frozen or two-component — Two-component kit uses a 1:1 mix ratio
Mix ratio 1:1 — Part A:Part B for two-component kits
Viscosity 9,000 mPa·s (cP) Brookfield CP51, 5 rpm at 25°C
Specific gravity 4.1 — SDS physical-property value
Work life 8 hours At 25°C; endpoint is a 25% increase in viscosity
Storage life — premixed frozen 365 days Continuously stored at -40°C
Storage life — two-component kit 365 days At 25°C
Cure schedule 2 hours, 4 hours, or 1 hour — 2 hours at 125°C, 4 hours at 100°C, or 1 hour at 150°C; guideline recommendations
Technical properties

After-processing / final-state properties

Typical cured-material properties and bonded-joint performance. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Glass-transition temperature 66 °C TMA; cure condition not stated
Coefficient of thermal expansion — below Tg 73 ppm/°C TMA; cure condition not stated
Coefficient of thermal expansion — above Tg 390 ppm/°C TMA; cure condition not stated
Thermal conductivity 2.1 W/(m·K) Test method, temperature, bondline thickness, and orientation not stated
Weight loss at 300°C 0.2 % Test method and exposure duration not stated
Volume resistivity 0.0002 ohm-cm Test method, geometry, and cure condition not stated
Lap shear strength — aluminum to aluminum 5.17 (750) N/mm² (psi) Tested at 25°C; substrate preparation, bondline, cure condition, and test method not stated

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