ABLESTIK 931-1
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low-Viscosity Fine-Gap Encapsulation
- Low-Exotherm One-Step Casting Cure
- 27.6 kV/mm Dielectric Strength
Product Description
LOCTITE® ECCOBOND 931-1 is a one-component, heat-cured epoxy encapsulant designed for general potting applications. Its low viscosity and wetting characteristics support impregnation of tightly wound coils and flow around closely packed components. The clear-amber material provides a typical viscosity of 300 cP at 25°C and a six-hour work life at 25°C. Its low-exotherm formulation supports one-step curing of large castings under suitable process conditions, with guideline cure options including 1 hour at 100°C or short heat exposure followed by 24 hours at 25°C.
Key features
- Low-viscosity impregnation: Typical viscosity of 300 cP at 25°C supports flow into tightly wound coils and intricate assemblies.
- Low-exotherm curing: Formulated to support one-step curing of large castings under appropriately validated process conditions.
- Electrical insulation: Typical cured properties include dielectric strength of 27.6 kV/mm and volume resistivity of 2 × 1014 ohm-cm.
Applications / Suitable for
- General potting applications
- Impregnation of tightly wound coils
- Encapsulation of closely packed components
- Large castings requiring controlled low-exotherm processing
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Clear amber
Appearance at room temperature.
Chemistry Type
Epoxy
Work life @25°C
6 hours
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
Thermal Properties
Glass Transition Temperature (Tg)
100 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.2 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Dielectric Strength
27.6 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
2×10¹⁴ Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Physical Properties
Viscosity
300 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties, storage conditions, work life, and guideline cure schedules for the encapsulant before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component encapsulant |
| Appearance | Clear amber liquid | — | As supplied |
| Viscosity | 300 | cP | At 25°C; test method not stated |
| Density | 1.1 | g/cm³ | As supplied |
| Work life | 6 | hours | At 25°C |
| Shelf life | 365 | days | At -40°C, from date of manufacture |
| Shelf life | 182 | days | At 5°C, from date of manufacture |
| Cure schedule | 1 hour, 5 minutes plus 24 hours, or 3 minutes plus 24 hours | — | 1 hour at 100°C; 5 minutes at 100°C plus 24 hours at 25°C; or 3 minutes at 130°C plus 24 hours at 25°C; guideline recommendations |
Technical properties
After-processing / final-state properties
Typical physical, thermal, ionic, and electrical properties of the cured encapsulant. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 88 | Shore D | Cure condition and test method not stated |
| Density — cured | 1.2 | g/cm³ | Test method and cure condition not stated |
| Glass-transition temperature | 100 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion — below Tg | 67 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 240 | ppm/°C | TMA; cure condition not stated |
| Weight loss at 150°C | 0.08 | % | Test method and exposure duration not stated |
| Weight loss at 250°C | 0.3 | % | Test method and exposure duration not stated |
| Weight loss at 300°C | 1.0 | % | Test method and exposure duration not stated |
| Water-extract conductivity | 51 | µmhos/cm | Extraction conditions and test method not stated |
| Extractable chloride | 100 | ppm | Test method and extraction conditions not stated |
| Extractable sodium | 5 | ppm | Test method and extraction conditions not stated |
| Extractable potassium | 5 | ppm | Test method and extraction conditions not stated |
| Thermal conductivity at 121°C | 0.2 | W/(m·K) | Test method and specimen configuration not stated |
| Dielectric strength | 27.6 (700) | kV/mm (V/mil) | Test method, thickness, and conditioning not stated |
| Dielectric constant | 4.5 | — | Frequency and test method not stated |
| Dissipation factor | 0.026 | — | Frequency and test method not stated |
| Volume resistivity | 2 × 1014 | ohm-cm | Test method and cure condition not stated |
