ABLESTIK 85-1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Gold-Filled Conductive Die-Attach Adhesive
- 49 N/mm^2 Shear Strength
- 1-Hour 150 deg C Cure
Product Description
LOCTITE® ABLESTIK 85-1 is a gold-filled, electrically conductive epoxy adhesive developed for die-attach applications where silver migration is a critical concern. The gold-brown, heat-cured material provides a typical two-day work life at 25°C and guideline cure options of 1 hour at 150°C or 2 hours at 125°C. Typical cured performance includes volume resistivity of ≤0.001 ohm-cm and die shear strength of 49 N/mm² for a 2 × 2 mm gold die bonded to a gold substrate at 25°C. The product is also documented as meeting the requirements of MIL-STD-883, Method 5011.
Key features
- Gold-filled conductive adhesive: Designed for hybrid applications where silver migration is a critical concern.
- High die shear performance: Typical die shear strength is 49 N/mm² for a 2 × 2 mm gold die on a gold substrate at 25°C.
- Documented electrical conductivity: Typical cured volume resistivity is ≤0.001 ohm-cm.
Applications / Suitable for
- Die-attach applications
- Hybrid electronic assemblies
- Applications where silver migration is a critical concern
- Gold-die-to-gold-substrate bonding under the documented test condition
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical appearance, handling, storage, and guideline cure information for the adhesive before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Heat-cured die-attach adhesive |
| Appearance | Gold brown paste | — | TDS appearance and SDS physical state |
| Filler type | Gold | — | Conductive filler |
| pH | 5.0 | — | TDS value; test method and condition not stated |
| Specific gravity | 4.7 | — | SDS physical-property value |
| Viscosity | 5,000–6,000 | cP | SDS value; temperature and test method not stated |
| Work life | 2 | days | At 25°C |
| Shelf life | 365 | days | At -40°C, from date of manufacture |
| Cure schedule | 1 hour or 2 hours | — | 1 hour at 150°C or 2 hours at 125°C; guideline recommendations |
After-processing / final-state properties
Typical cured-material properties and die-attach performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 107 | °C | TMA; cure condition not stated |
| Coefficient of thermal expansion — below Tg | 52 | ppm/°C | Test method and cure condition not stated |
| Coefficient of thermal expansion — above Tg | 200 | ppm/°C | Test method and cure condition not stated |
| Thermal conductivity at 121°C | 2.07 | W/°C | Unit reported in TDS; test method and specimen geometry not stated |
| Extractable chloride | 115 | — | Unit and test method not stated |
| Extractable sodium | 10 | — | Unit and test method not stated |
| Extractable potassium | 5 | — | Unit and test method not stated |
| Water-extract conductivity | 15 | µmhos/cm | Extraction conditions and test method not stated |
| Weight loss at 300°C | 0.22 | % | Test method and exposure duration not stated |
| Volume resistivity | ≤0.001 | ohm-cm | Test method and cure condition not stated |
| Die shear strength — 2 × 2 mm gold die on gold substrate | 49 (7,050) | N/mm² (psi) | Tested at 25°C; cure condition and test method not stated |
| Lap shear strength | ≥1,800 | psi | Substrates, test method, cure condition, bondline, and test temperature not stated |
