ABLESTIK 8380

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 8380

Main features

  • Reduced Tailing and Stringing in Smart-Card Assembly
  • 1-Minute 150 deg C Cure
  • 0.0005 ohm-cm Volume Resistivity

Product Description

LOCTITE® ABLESTIK 8380 is a silver-filled, electrically conductive epoxy adhesive developed for high-volume, reel-to-reel smart-card die-attach applications. Its rheology is formulated to support rapid automated dispensing and die placement while reducing tailing and stringing. The heat-cured adhesive provides a typical viscosity of 10,000 mPa·s at 25°C, a thixotropic index of 4.3, and guideline cure options of 1 minute at 150°C or 4 minutes at 125°C. Typical cured performance includes volume resistivity of 0.0005 ohm-cm and die shear strength of 33.1 N/mm² for an 80 mil² silicon die bonded to a silver-plated copper leadframe at room temperature.

Key features

  • High-speed dispensing rheology: Formulated to reduce tailing and stringing while supporting short adhesive-dispense and die-placement dwell times.
  • Fast heat cure: Guideline schedules include 1 minute at 150°C or 4 minutes at 125°C.
  • Electrical conductivity: Typical cured volume resistivity is 0.0005 ohm-cm.

Applications / Suitable for

  • Smart-card die attach
  • High-volume reel-to-reel assembly
  • High-speed automated die bonding
  • Silicon-die attachment to silver-plated copper leadframes under the documented test condition
Product Family

ABLESTIK 8380

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Chemistry Type
Epoxy
Thermal Properties
Weight Loss @ 300°C
0.4 %
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0005 Ohms⋅cm
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
4.3
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
10000 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties, storage information, and guideline cure schedules for the adhesive before final processing.

Property Value Unit Method / condition
Technology Epoxy — Electrically conductive die-attach adhesive
Appearance Silver liquid or paste — TDS appearance and SDS physical state
pH 4.25 — Test method and condition not stated
Viscosity 10,000 mPa·s At 25°C; test method not stated
Thixotropic index 4.3 — Test details not stated
Specific gravity 3.6 — SDS physical-property value
Storage life 365 days At -40°C, from date of manufacture
Cure schedule 1 minute or 4 minutes — 1 minute at 150°C or 4 minutes at 125°C; guideline recommendations
Weight loss on cure 1.3 % Cure profile and test method not stated
Technical properties

After-processing / final-state properties

Typical cured-material properties and die-attach performance. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Coefficient of thermal expansion — below Tg 56 ppm/°C TMA; cure condition not stated
Coefficient of thermal expansion — above Tg 170 ppm/°C TMA; cure condition not stated
Extractable chloride 100 ppm Extraction conditions and test method not stated
Extractable sodium 10 ppm Extraction conditions and test method not stated
Extractable potassium 10 ppm Extraction conditions and test method not stated
Water-extract conductivity 65 µmhos/cm Extraction conditions and test method not stated
Weight loss at 300°C 0.4 % TGA; exposure duration and cure condition not stated
Volume resistivity 0.0005 ohm-cm Test method and cure condition not stated
Die shear strength — 80 mil² silicon die on silver-plated copper leadframe 33.1 (4,800) N/mm² (psi) Tested at room temperature; cure condition and test method not stated

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