LOCTITE ABLESTIK 8360

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK 8360

Main features

  • Excellent dispensability
  • Miinimal resin bleed
  • Minimal tailing and stringing

Product Description

LOCTITE ABLESTIK 8360 electrically conductive, epoxy die attach adhesive is designed for high reliability packaging applications. Its unique properties result in superior autoclave reliability test performance of the final assembled devices.

LOCTITE ABLESTIK 8360 offers excellent dispensability with minimal tailing and stringing. It has a low amount of condensable volatiles and high purity. LOCTITE ABLESTIK 8360 meets the requirements of MIL-STD-883, Method 5011

Cure Schedule

  • 1 hour @ 175°C
  • 5ºC per minute ramp to 175ºC + 1 hour @ 175ºC
  • 2 hours @ 100°C + 30 minute ramp to 175°C + 1 hour @ 175ºC
Product Family

ABLESTIK 8360

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
20 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
88 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.9 W/m.K
Weight Loss @ 300°C
0.7 %
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0005 Ohms⋅cm
Chemical Properties
Moisture absorption
0.55 %
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
4.2
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
7,900 mPa.s

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