ABLESTIK 816H01
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- 2.0 W/(m K) Thermal Interface
- Three-Hour Working Window
- Room-Temperature Thermal Interface Cure
Product Description
LOCTITE® ABLESTIK 816H01 is a two-component, thermally conductive and electrically insulating epoxy adhesive for component assembly. The white, thixotropic system mixes at 100:15 by weight and is intended for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards. It develops high-impact bonds while supporting heat transfer and electrical isolation. The adhesive provides a typical mixed viscosity of 5,000 mPa·s at 25°C, a three-hour work life for a 25 g mass, and room-temperature or accelerated heat-cure options.
Key features
- Thermally conductive and electrically insulating: Typical cured thermal conductivity is 2.0 W/(m·K), supporting heat transfer while maintaining electrical isolation.
- Thixotropic processing: A typical mixed viscosity of 5,000 mPa·s at 25°C supports controlled component-staking application.
- Room-temperature or heat cure: Guideline schedules include 24 hours at 25°C or 2 to 4 hours at 65°C.
Applications / Suitable for
- Staking transistors, diodes, resistors, and integrated circuits to printed circuit boards
- Assembly of heat-sensitive electronic components
- Non-conductive component bonding
- Bonding metals, silica, steatite, alumina, sapphire, ceramics, glass, and plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
White
Appearance at room temperature.
Chemistry Type
Epoxy
Mix Ratio
100 : 15
The amount of a constituent divided by the total amount of all other constituents in a mixture
Pot Life
1 hours
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.
It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
Work life @25°C
3 hours
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
Thermal Properties
Glass Transition Temperature (Tg)
54 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
-70 to 115 °C
Thermal Conductivity
2.0 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical mixed properties, handling characteristics, and guideline cure schedules before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive system |
| Appearance | White | — | Mixed adhesive |
| Mix ratio — resin:hardener | 100:15 | by weight | Resin-to-hardener ratio |
| Mixed viscosity | 5,000 | mPa·s (cP) | Brookfield RV, spindle 3, at 25°C |
| Specific gravity — mixed | 1.300 | — | TDS reports the value as “1,300”; decimal interpretation requires confirmation |
| Pot life | 1 | hour | 25 g mass; temperature not stated |
| Work life | 3 | hours | 25 g mass; temperature not stated |
| VOC content | 8.12 | g/L | Mixed adhesive; method not stated |
| Cure schedule | 24 hours or 2–4 hours | — | 24 hours at 25°C or 2 to 4 hours at 65°C; guideline recommendations |
| Optimal storage | 27 | °C | TDS optimal-storage value; component SDSs state storage at or below 25°C |
Technical properties
After-processing / final-state properties
Typical physical, thermal, outgassing, and bonded-joint properties of the cured adhesive. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -70 to 115 | °C | Documented product range |
| Hardness | 80 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 54 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion | 4.0 × 10-5 | cm/cm/°C | Temperature range, test method, and cure condition not stated |
| Thermal conductivity | 2.0 | W/(m·K) | Test method, temperature, specimen geometry, and cure condition not stated |
| Reactive solids content | 100 | % | Typical value |
| Total mass loss | 0.6 | % | TML; sample cured 3 hours at 65°C |
| Collected volatile condensable material | 0.02 | % | CVCM; sample cured 3 hours at 65°C |
| Lap shear strength — aluminum to aluminum | 1,700 | psi | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
