ABLESTIK 5074

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 5074

Main features

  • Flexible Dissimilar-Material Bonding
  • Multiple Heat-Cure Options
  • Reworkable Non-Conductive Film

Product Description

LOCTITE ABLESTIK 5074 is a configurable, non-conductive epoxy adhesive film reinforced with glass fabric for electronics assembly. The flexible, reworkable film is used across mixed-material interfaces, with thickness and dimensions selected for the supplied configuration. It has a 24-hour work life at 25 deg C and can be heat cured for 180 minutes at 100 deg C, 90 minutes at 125 deg C, or 60 minutes at 150 deg C. The cured material has a typical thermal conductivity of 0.9 W/(m K). It is supplied as sheet stock or die-cut preforms.

Key features

  • Flexible mixed-material film: Bonds dissimilar materials with differing coefficients of thermal expansion in electronics assemblies.
  • Multiple heat-cure options: Three supported time-and-temperature schedules provide practical cure flexibility for the assembly process.
  • Reworkable non-conductive construction: Provides a non-conductive film bond in a format intended for assemblies that may require rework.

Applications

Applications include electronics assembly bonding of dissimilar materials with differing coefficients of thermal expansion.

Product Family

ABLESTIK 5074

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
White
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
3 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Supplied thickness and dimensions depend on the selected sheet or die-cut configuration.

PropertyValueUnitMethod / condition
AppearanceWhiteAs supplied
Film constructionEpoxy-coated glass fabricConfigurable 5074 family
Work life24hours25 deg C
Shelf life183days-40 deg C; from date of manufacture
Available formsSheet stock or die-cut preformsThickness and dimensions are configuration-specific
Cure schedule180 at 100; 90 at 125; 60 at 150minutes at deg CGuideline heat-cure options
Technical properties

After-processing / final-state properties

Final-state values are typical for the cured 5074 family material and the stated test configurations.

PropertyValueUnitMethod / condition
Coefficient of thermal expansion, below Tg45ppm/deg CTypical
Coefficient of thermal expansion, above Tg350ppm/deg CTypical
Glass transition temperature3deg CTypical
Thermal conductivity0.9W/(m K)Laser flash
Lap shear strength8N/mm^2Aluminum-to-aluminum; 25 deg C
Lap shear strength5N/mm^2Gold-to-gold; 25 deg C

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