ABLESTIK 2958

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK 2958

Main features

  • Electrically Conductive Bonding
  • 40,000 mPa s Mixed Viscosity
  • 15-Minute 100 deg C Cure

Product Description

LOCTITE ABLESTIK 2958 is a silver-filled, two-component epoxy adhesive for electrically conductive bonding and sealing in electronic and microelectronic assemblies. The 100% reactive-solids system mixes at 100:6 resin-to-hardener by weight and forms a smooth, screen-printable paste with a typical mixed viscosity of 40,000 mPa.s (cP) at 25 degC and a four-hour pot life. It supports snap-cure schedules as short as 2 minutes at 150 degC and is documented for chip bonding, electrical modules, printed circuitry, wave guides, high-frequency shields, and die-attach applications.

Key Features

  • Silver-filled, electrically and thermally conductive epoxy adhesive
  • Two-component, 100% reactive-solids formulation with no contaminating solvents or additives
  • 100:6 resin-to-hardener mix ratio by weight
  • Typical mixed viscosity of 40,000 mPa.s (cP) at 25 degC
  • Four-hour pot life and thixotropic index of 2.9
  • Heat-cure schedules from 15 minutes at 100 degC to 2 minutes at 150 degC
  • Operating-temperature range of -60 to 175 degC

Applications / Suitable for

  • Chip bonding and die-attach bonding
  • Electrical modules and printed circuitry
  • Wave guides and high-frequency shields
  • Electronic and microelectronic bonding or sealing
Product Family

ABLESTIK 2958

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Chemistry Type
Epoxy
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
100 : 6
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
4 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.65
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
92 °C
Operating Temperature
-60 to 175 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.50×10⁰⁰ W/m.K
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
2.9

Additional Information

Electrically Conductive Electronics Adhesive

LOCTITE ABLESTIK 2958

LOCTITE ABLESTIK 2958 is a silver-filled, two-component epoxy adhesive for electrically conductive bonding and sealing in electronic, microelectronic, and die-attach applications. The smooth paste is screen printable, contains 100% reactive solids, and combines a four-hour pot life with snap-cure schedules down to 2 minutes at 150 degC.

Silver filled Electrically conductive Thermally conductive Screen printable Snap curable
LOCTITE ABLESTIK 2958 silver-filled two-component conductive epoxy adhesive packaging

Resin, Hardener and Mixed Paste

As-Supplied Properties

The system consists of silver-filled LOCTITE ABLESTIK 2958-R conductive epoxy resin and LOCTITE ABLESTIK 2958-H epoxy hardener. The TDS provides mixed-state process properties, while the current U.S. SDS documents component-specific physical state, color, and relative density.

Typical as-supplied and mixed properties
Material state Property Typical value Condition / context
2958-R resin Physical state / color Silver liquid paste Conductive epoxy component
2958-R resin Relative density 3.5 Current U.S. SDS
2958-H hardener Physical state / color Colorless to amber liquid Epoxy hardener component
2958-H hardener Relative density 1.0 Current U.S. SDS
Mixed material Mix ratio 100 : 6 Resin : hardener by weight
Mixed material Viscosity 40,000 mPa.s (cP) 25 degC
Mixed material Thixotropic index 2.9 5 / 50 rpm
Mixed material Specific gravity 2.65 Mixed system
Mixed material Reactive solids content 100% Mixed system
Mixed material Pot life 4 hours Supplier TDS value
 

Storage and Handling

The TDS identifies 27 degC as the optimal storage temperature for unopened product in a dry location. Keep component containers closed and protect them from contamination. Material removed from a container should not be returned to the original container. The current U.S. resin SDS specifies a safe storage range of -20 to 50 degC, while the hardener SDS requires cool, well-ventilated storage away from incompatible materials and heat or ignition sources.

Final Conductive Bondline

Cured Properties

The cured epoxy provides both electrical and thermal conductivity. Bulk properties are presented separately from bonded-joint strength because conductivity, resistance, and mechanical performance remain dependent on cure, geometry, interfaces, and the tested configuration.

Thermal conductivity
1.50 W/(m-K)

Typical cured bulk-material value.

Volume resistivity
0.0003 ohm-cm

Typical value after 5 minutes at 125 degC.

Operating temperature
-60 to 175 degC

Documented product operating-temperature range.

Typical cured physical, electrical, and mechanical properties
Property Typical result Condition / context
Coefficient of thermal expansion 4.9 x 10^-5 cm/cm/degC Typical cured value
Glass transition temperature 92 degC Typical cured value
Thermal conductivity 1.50 W/(m-K) Typical cured bulk value
Hardness 80 Shore D Typical cured value
Volume resistivity 0.0005 ohm-cm After 2 minutes at 150 degC
Volume resistivity 0.0003 ohm-cm After 5 minutes at 125 degC
Aluminum lap shear strength 7 N/mm2 (1,000 psi) Aged / cured at 150 degC for 2 minutes
Aluminum lap shear strength 7 N/mm2 (1,000 psi) Aged / cured at 125 degC for 5 minutes

Documented Electronics Assembly Uses

Applications

Chip and Die Attach

The supplier positions ABLESTIK 2958 for chip bonding and die-attach bonding where an electrically conductive cured epoxy path is required. Final fit depends on die, metallization, bondline, cure, and package design.

Electrical Modules and Printed Circuitry

The screen-printable conductive paste is documented for electrical modules and printed circuitry, supporting evaluation where adhesive bonding and electrical conduction are combined.

Wave Guides and High-Frequency Shields

The TDS lists wave guides and high-frequency shields among typical assembly applications. Electrical performance remains dependent on the actual joint geometry, interfaces, and cured condition.

Technical Support for LOCTITE ABLESTIK 2958

Discuss mix-ratio control, pot life, screen printing or other deposition, cure profiling, bondline design, electrical interconnection, and die-attach evaluation with Krayden. Process trials should confirm performance in the intended component, substrate, metallization, joint geometry, cure, and operating environment.

Contact Krayden Technical Support

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