ABLESTIK 24
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Water-Clear Thin-Bondline Adhesive
- 30-Minute Pot Life
- Flexible Cured Adhesive
Product Description
LOCTITE® ABLESTIK 24 is a water-clear, two-part epoxy adhesive for non-electrically conductive assembly bonding. It is recommended for joining transparent materials such as glass and for applications where a thin bond line is desired. The mixed adhesive has a viscosity of 800 mPa·s at 25 °C and a 30-minute pot life in 50 g quantities. It cures at room temperature, with full properties developed in 16 to 24 hours, and forms flexible, resilient bonds between materials with mismatched coefficients of thermal expansion.
Key features
- Water-clear epoxy system: Supports transparent-material bonding where adhesive appearance and thin bond lines are important.
- Room-temperature cure: Two-part system cures at 25 °C, with full properties developed in 16 to 24 hours.
- Flexible cured adhesive: Forms resilient bonds between materials with mismatched coefficients of thermal expansion.
Applications / Suitable for
- Joining transparent materials such as glass
- Thin bond-line adhesive assembly
- Non-electrically conductive bonding of metals, ceramics, polycarbonate, polystyrene, polysulfone, and rigid plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Mix Ratio
100:28
The amount of a constituent divided by the total amount of all other constituents in a mixture
Pot Life
30 minutes
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.
It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
Thermal Properties
Thermal Conductivity
0.2 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Electrical Properties
Dielectric Strength
16.5 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
1E14 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical values for the mixed two-part adhesive before final cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive system |
| Appearance | Water clear | — | As supplied / mixed adhesive appearance |
| Mix ratio | 100:28 | — | Part A:Part B by weight |
| Mixed viscosity | 800 | mPa·s | Mixed material at 25°C |
| Pot life | 30 | minutes | At 25°C, 50 g quantities |
| Cure schedule | 1 to 3 | hours | At 25°C; full properties develop in 16 to 24 hours |
| Optimal storage | 18 to 25 | °C | Store in original, tightly covered containers in clean, dry areas |
Technical properties
After-processing / final-state properties
Typical values for the cured adhesive after room-temperature cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tensile lap shear strength | 12 | N/mm² | Typical performance of cured material |
| Thermal conductivity | 0.2 | W/(m·K) | Typical cured-material physical property |
| Coefficient of linear thermal expansion | 60 | ppm/°C | Typical cured-material physical property |
| Volume resistivity | 1 × 10¹⁴ | ohm-cm | At 25°C |
| Dielectric strength | 16.5 | kV/mm | ASTM D149 |
| Operating temperature | 90 continuous; 120 intermittent | °C | Cured adhesive service exposure |
