ABLESTIK 2248
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Thixotropic Application Control
- 14.8 kV/mm Dielectric Strength
- 1-Hour Working Window
Product Description
LOCTITE® ABLESTIK 2248 BIPAX is a two-component, heat-cured epoxy staking compound supplied in a mixing-dispenser package. The tan, thixotropic system mixes at 100:19.4 resin-to-hardener by weight and is documented for bonding metals, glass, ceramics, and plastics. It combines toughness, impact resistance, thermal-shock resistance, and low permeability to gases and vapors with a two-hour pot life and a guideline cure schedule of 1 hour at 100°C. Typical cured properties include an operating-temperature range of -60 to 190°C, Shore D hardness of 87, tensile strength of 72.4 N/mm², and volume resistivity of 2.50 × 1015 ohm-cm at 25°C.
Key features
- Tough, thermally durable system: Documented for good toughness, impact resistance, thermal-shock resistance, and service from -60 to 190°C.
- Controlled thixotropic handling: Typical mixed viscosity is 10,000 mPa·s at 25°C with a two-hour pot life.
- Electrical insulation: Typical cured volume resistivity is 2.50 × 1015 ohm-cm at 25°C, with dielectric strength of 14.8 kV/mm.
Applications / Suitable for
- Staking applications
- Bonding metals, glass, ceramics, and plastics
- Assemblies exposed to thermal shock or elevated service temperatures
- Applications requiring low permeability to gases and vapors
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Tan
Appearance at room temperature.
Chemistry Type
Epoxy
Mix Ratio
100 : 19.4
The amount of a constituent divided by the total amount of all other constituents in a mixture
Pot Life
2 hours
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.
It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
Specific Gravity
1.2
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Thermal Properties
Glass Transition Temperature (Tg)
109.0 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
-60 to 190 °C
Mechanical Properties
Elongation
2 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Chemical Properties
Water Absorption
0.001 %
Electrical Properties
Dielectric Strength
14.8 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
2.50×10¹⁵ Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical mixed, handling, storage, and guideline cure information before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component heat-cured staking compound |
| Appearance — mixed | Tan | — | Uniformly mixed BIPAX system |
| Appearance — resin | Light yellow liquid | — | LOCTITE ABLESTIK 2248-R SDS |
| Appearance — hardener | Amber to brown liquid | — | LOCTITE ABLESTIK 2248-H SDS |
| Mix ratio — resin:hardener | 100:19.4 | by weight | Documented BIPAX mix ratio |
| Mixed viscosity | 10,000 | mPa·s (cP) | Brookfield LV, spindle 4, 12 rpm at 25°C |
| Specific gravity — mixed | 1.2 | — | Typical mixed value |
| Specific gravity — resin | 1.3 | — | LOCTITE ABLESTIK 2248-R SDS |
| Specific gravity — hardener | 1.0 | — | LOCTITE ABLESTIK 2248-H SDS |
| Pot life | 2 | hours | Temperature and test mass not stated |
| Guideline cure schedule | 1 | hour | At 100°C |
| Application-dependent post-cure | 2 | hours | At 125°C when anticipated application temperatures exceed 125°C |
| Optimal storage | ≤27 | °C | TDS storage value; component SDSs specify storage at or below 25°C |
Technical properties
After-processing / final-state properties
Typical cured physical, thermal, electrical, outgassing, and bonded-joint properties. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -60 to 190 | °C | Documented product range |
| Hardness | 87 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 109 | °C | Method and cure condition not stated |
| Coefficient of expansion | 50 | ppm/°C | Temperature range, method, and cure condition not stated |
| Heat-distortion temperature | 148 | °C | Method and cure condition not stated |
| Water absorption | 0.001 | % | After 24-hour immersion |
| Izod impact strength | 0.52 | ft-lb/in of notch | Test method and cure condition not stated |
| Elongation | 2 | % | Test method and cure condition not stated |
| Dielectric strength | 14.8 | kV/mm | Test method, specimen thickness, and cure condition not stated |
| Dielectric constant | 4.35 | — | At 1 kHz and 25°C |
| Dissipation factor | 0.02 | — | At 1 kHz and 25°C |
| Volume resistivity | 2.50 × 1015 | ohm-cm | At 25°C |
| Outgassing | Passes | — | ASTM E595-90 |
| Lap shear strength — aluminum to aluminum | 17.9 (2,600) | N/mm² (psi) | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
| Tensile strength | 72.4 (10,500) | N/mm² (psi) | Test method and cure condition not stated |
