ABLESTIK 2158
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Electrically Insulating Staking Epoxy
- Flexible Mismatched-Adherend Bonding
- 2 x 10^15 ohm-cm Volume Resistivity
Product Description
LOCTITE® ABLESTIK 2158 BIPAX is a two-component, thermally conductive and electrically insulating epoxy adhesive for staking and assembly applications. The tan system mixes at 100:38 resin-to-hardener by weight and develops durable, high-impact bonds at room temperature or with accelerated heat cure. It is documented for attaching transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards and for bonding many metals, silica, steatite, alumina, sapphire, glass, plastics, and ceramics. The mixed adhesive provides a typical viscosity of 15,000 mPa·s at 25°C, a three-hour pot life, and an operating-temperature range of -70 to 125°C.
Key features
- Thermally conductive and electrically insulating: Typical cured properties include thermal conductivity of 0.84 W/(m·K) and volume resistivity of 2 × 1015 ohm-cm at 75°C.
- Flexible bonding performance: Designed to support bonding between adherends with mismatched physical characteristics.
- Room-temperature or heat cure: Guideline schedules include 24 hours at 25°C or 2 to 4 hours at 65°C.
Applications / Suitable for
- Staking transistors, diodes, resistors, and integrated circuits to printed circuit boards
- Assembly of heat-sensitive electronic components
- Bonding many metals, glass, plastics, and ceramics
- Bonding silica, steatite, alumina, and sapphire
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical component, mixed, handling, storage, and guideline cure information before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive requiring mixing |
| Appearance — mixed | Tan | — | Uniformly mixed BIPAX system |
| Appearance — resin | Tan paste / liquid | — | LOCTITE ABLESTIK 2158-R SDS |
| Appearance — hardener | Amber liquid | — | LOCTITE ABLESTIK 2158-H SDS |
| Mix ratio — resin:hardener | 100:38 | by weight | Documented BIPAX mix ratio |
| Mixed viscosity | 15,000 | mPa·s (cP) | At 25°C; test method not stated |
| Specific gravity — mixed | 2.3 | — | Typical TDS value |
| Specific gravity — resin | 2.5 | — | LOCTITE ABLESTIK 2158-R SDS |
| Specific gravity — hardener | 0.95 | — | LOCTITE ABLESTIK 2158-H SDS |
| Pot life | 3 | hours | Temperature and test mass not stated |
| Recommended cure schedule | 24 | hours | At 25°C; guideline recommendation |
| Alternative cure schedule | 2–4 | hours | At 65°C; guideline recommendation |
| Optimal storage | 25 | °C | Store unopened in a dry location; shelf life is stated on the package label |
After-processing / final-state properties
Typical cured thermal, electrical, physical, and bonded-joint properties. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -70 to 125 | °C | Documented product range |
| Hardness | 60 | Shore D | Cure condition and test method not stated |
| Thermal conductivity | 0.84 | W/(m·K) | Test method, test temperature, specimen geometry, and cure condition not stated |
| Reactive solids content | 100 | % | Typical TDS value |
| Volume resistivity | 2 × 1015 | ohm-cm | At 75°C; test method and cure condition not stated |
| Dielectric strength | 410 | V/mil | Test method, specimen thickness, conditioning, and cure condition not stated |
| Dielectric constant | 5.9 | — | At 1 kHz and 25°C |
| Dissipation factor | 0.01 | — | At 1 kHz and 25°C |
| Lap shear strength — aluminum to aluminum | 12.75 (1,850) | N/mm² (psi) | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
