LOCTITE ABLESTIK 2101

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

LOCTITE ABLESTIK 2101

Main features

  • 23 N/mm^2 Aluminum Lap Shear
  • High-Resistivity Electrical Insulation
  • Fuel, Oil, and Acid Resistance

Product Description

LOCTITE ABLESTIK 2101 BIPAX is a two-component, non-conductive epoxy adhesive supplied as a clear to slightly hazy liquid at a 100:25 resin-to-hardener mix ratio. Packaged in a convenient BIPAX mixing-dispenser for easy mixing, it cures at room temperature over 24 hours or faster with a heat cure of 4 hours at 65°C, and is suitable for continuous service from -60°C to 135°C. The adhesive bonds metals, ceramics, glass, wood, leather, and many rigid plastics, and is well suited to laminating, bonding, and repair applications requiring structural, mechanical, and electrical performance. Cured material offers strong electrical insulation and broad chemical resistance, including to petroleum solvents, fuels, and mild acids and alkalis.

Key features

  • High lap shear strength: 23 N/mm² (3,300 psi) on aluminum-to-aluminum bonds.
  • Good electrical insulator: Volume resistivity of 6×10¹⁵ ohm-cm at 25°C.
  • Easy mixing: Supplied in a BIPAX package for convenient, uniform two-component mixing.

Applications / Suitable for: Laminating, bonding, and repair of metals, ceramics, glass, wood, leather, and rigid plastics where structural, mechanical, and electrical insulating performance are required.

Product Family

ABLESTIK 2101

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.2
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
19000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
62 °C
Operating Temperature
-60 TO 135 °C
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6000000000000000 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the uncured, mixed material prior to cure.

Property Value Unit Method / condition
Mix ratio (Resin : Hardener) 100 : 25 by weight —
Viscosity, mixed 19,000 mPa·s (cP) @ 25°C
Specific gravity, mixed 1.2 — Mixed material
Pot life 30 minutes @ 25°C, mixed
Technical properties

After-processing / final-state properties

Typical properties of the fully cured material after the recommended cure schedule.

Property Value Unit Method / condition
Glass transition temperature (Tg) 62.0 °C Cured material
Volume resistivity 6×10¹⁵ ohm·cm @ 25°C
Dielectric strength 370 volts/mil Cured material
Coefficient of linear thermal expansion 55 ppm/°C Cured material
Lap shear strength, Al to Al 23 (3,300)

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