3M 282

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

3M 282

Main features

  • Thixotropic Low-Sag Application
  • Multi-Method Resin Placement
  • Semiflexible Class F Performance

Product Description

3M Scotchcast Electrical Resin 282 is a two-part, oven-curing, thixotropic epoxy liquid resin for coating, filling, patching, insulating, and encapsulating electrical components. The stated component ratio is 2:3 by weight and 37:63 by volume. Once combined, the material retains thixotropic flow for dipping, spraying, extruding, or troweling with minimal run-off or sag during cure. Typical pot life is 3 to 4 days at 23 deg C, with 23-minute gel time at 121 deg C. The cured semiflexible Class F resin provides 65 Shore D hardness, 45% elongation, and thermal-shock resistance for coils, transformers, motors, modules, and strain-sensitive circuitry.

Key features

  • Thixotropic low-sag handling: The mixed resin limits run-off and sag during supported coating and cure operations.
  • Multiple application methods: The material can be applied by dipping, spraying, extruding, or troweling.
  • Semiflexible Class F cure: Typical cured properties include 65 Shore D hardness, 45% elongation, and a 155 deg C temperature rating.

Applications

Applications include dipping, coating, filling, patching, insulating, and encapsulating coils, transformers, motors, modules, strain-sensitive circuitry, and other electrical or electronic components.

Product Family

3M 282

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Buff
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A / B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
3-4 days
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.43
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
45 %
Other Properties
Storage Temperature
20 - 30 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Handling values are typical; component values and mix-ratio bases remain separated.

PropertyValueUnitMethod / condition
Mix ratio by weight (A:B)2:3-Before processing
Mix ratio by volume (A:B)37:63%Before processing
RheologyThixotropic-Parts A and B and mixed resin at 23 deg C
Density (A / B)1.50 / 1.32kg/LTypical
Flash point (A / B)202 / 188deg CTypical
Gel time23minTypical at 121 deg C
Cure guide15 to 20 h / 6 to 8 h / 2 to 3 h-75 deg C / 95 deg C / 120 deg C
Pot life3 to 4daysTypical at 23 deg C
ColorBuff-Typical
Technical properties

Final-state / after-processing properties

Cured values are typical and are not specification limits.

PropertyValueUnitMethod / condition
Hardness65Shore DTypical
Specific gravity1.43-Typical; cured
Compressive strength3,500psiTypical; 10% compression
Tensile strength2,100psiTypical
Elongation at break45%Typical
Electric strength375 (14.8)V/mil (kV/mm)Typical; 1/8 in (3.175 mm) sample
Thermal-shock resultPass-10 cycles from -65 to 130 deg C; 1/4 in (3.175 mm) Olyphant insert
Moisture absorption0.32% weight increaseTypical; 240 h at 96% RH
Volume resistivity>1 x 10^15ohm-cmTypical at 23 deg C

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